References
[1]. IEA (2024), Global EV Outlook 2024, IEA, Paris https://www.iea.org/reports/global-ev-outlook-2024, Licence: CC BY 4.0
[2]. T. Jarin, P. V. Nisha, B. Deepanraj and H. Mewada, ‘Comparison of PCB and Conventional Power Transfer Coils in Magnetic Coupler Designs for Electric Vehicles,’ 2024 International Conference on Smart Systems for applications in Electrical Sciences (ICSSES), Tumakuru, India, 2024, pp. 1-6.
[3]. J. Yao, S. Wang and Z. Luo, ‘Radiated EMI Reduction by Layout Improvement in Power Converters in Automotive Applications,’ 2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), Nanjing, China, 2020, pp. 1894-1899.
[4]. D. Hamza, M. Pahlevaninezhad and P. K. Jain, "Implementation of a Novel Digital Active EMI Technique in a DSP-Based DC–DC Digital Controller Used in Electric Vehicle (EV)," in IEEE Transactions on Power Electronics, vol. 28, no. 7, pp. 3126-3137, July 2013, doi: 10.1109/TPEL.2012.2223764.
[5]. Songchun Zhang. Anti-interference technology for electronic control system and its application [M]. Beijing: China Machine Press 1998
[6]. Kuixuan Han. Introduction to Microwave Unified Measurement and Control System [M]. Beijing: National Defense Industry Press 1965
[7]. BoXue Tan. Principle and Application of Integrated Circuit [M]. Beijing: Publishing House of Electronics Industry 2003
[8]. P. Hemeng, H. Jianyao, J. Chunxu, L. Qunxing, X. Huawei and H. Zhiyuan, "Analysis for the EMI measurement and propagation path in Hybrid Electric Vehicle," 2016 IEEE Information Technology, Networking, Electronic and Automation Control Conference, Chongqing, China, 2016, pp. 1087-1090.
[9]. Zhai, L. (2021). EMI Prediction and Suppression of DC-DC Converter. In: Electromagnetic Compatibility of Electric Vehicle. Key Technologies on New Energy Vehicles. Springer, Singapore. https://doi.org/10.1007/978-981-33-6165-2_4
[10]. H. A. Huynh, Y. Han, S. Park, J. Hwang, E. Song and S. Kim, "Design and Analysis of the DC–DC Converter With a Frequency Hopping Technique for EMI Reduction," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 4, pp. 546-553, April 2018
[11]. J. Ji, W. Chen and X. Yang, "Design and precise modeling of a novel Digital Active EMI Filter," 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), Long Beach, CA, USA, 2016, pp. 3115-3120
[12]. Zhai, L. (2021). Electromagnetic Compatibility of Battery Management System. In: Electromagnetic Compatibility of Electric Vehicle. Key Technologies on New Energy Vehicles. Springer, Singapore. https://doi.org/10.1007/978-981-33-6165-2_7
[13]. D. Hamza, M. Pahlevaninezhad and P. K. Jain, ‘Implementation of a Novel Digital Active EMI Technique in a DSP-Based DC–DC Digital Controller Used in Electric Vehicle (EV),’ in IEEE Transactions on Power Electronics, vol. 28, no. 7, pp. 3126-3137, July 2013
[14]. D. Hamza, M. Pahlevaninezhad and P. K. Jain, ‘Implementation of a Novel Digital Active EMI Technique in a DSP-Based DC–DC Digital Controller Used in Electric Vehicle (EV),’ in IEEE Transactions on Power Electronics, vol. 28, no. 7, pp. 3126-3137, July 2013
[15]. Sorgucu, U. Electromagnetic interference (EMI) shielding effectiveness (SE) of pure aluminum: an experimental assessment for 5G (SUB 6GHZ). J Mater Sci: Mater Electron 34, 2325 (2023).
[16]. Novák, M., Rosina, J., Bendová, H. et al. Low-cost and prototype-friendly method for biocompatible encapsulation of implantable electronics with epoxy overmolding, hermetic feedthroughs and P3HT coating. Sci Rep 13, 1644 (2023).
[17]. Yadav, A., Bera, T.K. Ferrite shielding thickness and its effect on electromagnetic parameters in wireless power transfer for electric vehicles (EVs). J. Eng. Appl. Sci. 70, 132 (2023).
[18]. Shen, X., Kim, JK. Graphene and MXene-based porous structures for multifunctional electromagnetic interference shielding. Nano Res. 16, 1387–1413 (2023).
[19]. Yang, J., Wang, H., Zhang, Y. et al. Layered Structural PBAT Composite Foams for Efficient Electromagnetic Interference Shielding. Nano-Micro Lett. 16, 31 (2024).
[20]. Lee, J.S., Kim, JW., Lee, J.H. et al. Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding. Nano-Micro Lett. 15, 191 (2023).
[21]. Y. Zhang, J. Guo, H. Liu, X. Zhang, Y. Wang and Y. Fan, ‘EMI Measurement and Reduction for SiC MOSFET based Motor Drivers of Electric Vehicles,’ 2023 3rd International Conference on Electrical Engineering and Mechatronics Technology (ICEEMT), Nanjing, China, 2023, pp. 282-286
[22]. A. K. Ghose, S. K. Mandal and G. K. Deb, "PCB design with low EMI," 1995 International Conference on Electromagnetic Interference and Compatibility (INCEMIC), Madras, India, 1995, pp. 69-76, doi: 10.1109/ICEMIC.1995.501563.
[23]. C. R. Paul, Introduction to Electromagnetic Compatibility, John Wiley and Sons, 1992.
[24]. Chao Yang; Kun Yue; Thinking and analysis of PCB design process [J]. Technology and Innovation, 2023, (09): 153-155. DOI:10.15913/j.cnki.kjycx.2023.09.043
[25]. J. -M. Redouté and A. Richelli, ‘A methodological approach to EMI resistant analog integrated circuit design,’ in IEEE Electromagnetic Compatibility Magazine, vol. 4, no. 2, pp. 92-100, 2nd Quarter 2015, doi: 10.1109/MEMC.2015.7204058.
[26]. Han Yang, and Tao Chen.’ Automotive-grade PCB electromagnetic compatibility design.’ Internal combustion engine and accessories .13(2018):11-14.doi:10.19475/j.cnki.issn1674-957x.2018.13.005.
[27]. Z. He and H. Guo, ‘EMR Field Distribution Analysis of Crystal Oscillator on PCB,’2018 12th International Symposium on Antennas, Propagation and EM Theory (ISAPE), Hangzhou, China, 2018, pp. 1-4, doi: 10.1109/ISAPE.2018.8634183.
[28]. M. Ali, J. Friebe and A. Mertens, "3-D Electromagnetic Modeling and Analysis of Electromagnetic Field Couplings of EMI Filter Capacitors," 2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia), Singapore, Singapore, 2021, pp. 1299-1305, doi: 10.1109/ECCE-Asia49820.2021.9479282.
[29]. P. Kadlec, V. Šeděnka, M. Marek and M. Štumpf, "Optimizing a Decoupling Capacitor on a PCB: A Fully Time-Domain Approach Based on PSO and TD-CIM," 2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands, 2018, pp. 585-589, doi: 10.1109/EMCEurope.2018.8485008.
[30]. Shinichi Ikami and Akihisa Sakurai, ‘Practical analysis on 20H rule for PCB,’2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, Singapore, 2008, pp. 180-183, doi: 10.1109/APEMC.2008.4559841.
[31]. F. Gisin and Z. Pantic-Tanner, ‘Radiation from printed circuit board edge structures,’2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161), Montreal, QC, Canada, 2001, pp. 881-883 vol.2, doi: 10.1109/ISEMC.2001.950495.
[32]. Meishuang Chen, Sai Zhu, Lihua Cai, etal. Design for Integrated Circuit EMC Test PCB[J]. SAFETY&EMC, 2021(5):83-87
[33]. C. -H. Lee, C. -Y. Yao, H. -C. Li, D. -B. Lin and H. -P. Lin, "The study of PCB ground area and location on EMI reduction effectiveness," 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL), Singapore, 2017, pp. 1568-1571, doi: 10.1109/PIERS-FALL.2017.8293382.
[34]. S. Haga, K. Nakano and O. Hashimoto, ‘Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge,’2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, USA, 2002, pp. 262-267 vol.1, doi: 10.1109/ISEMC.2002.1032486.
[35]. Z. Ma, S. Wang, Q. Huang and Y. Yang, ‘A Review of Radiated EMI Research in Power Electronics Systems,’ in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 12, no. 1, pp. 675-694, Feb. 2024, doi: 10.1109/JESTPE.2023.3335972.
[36]. J. Yao, S. Wang, and Z. Luo, ‘Modeling, analysis, and reduction of radiated EMI due to the voltage across input and output cables in an automotive non-isolated power converter,’ IEEE Trans. Power Electron., vol. 37, no. 5, pp. 5455–5465, May 2022.
[37]. Ke Wu. Design optimization analysis of digital-analog hybrid PCB electromagnetic compatibility [J]. Integrated circuit applications, 2024, 41 (04): 39-41. DOI:10.19339/j.issn.1674-2583.2024.04.014.
[38]. W. Jiang, k. Cai, B. Sen and G. Wang, ‘Practical High Speed PCB Stack up Tool - Generation and Validation,’ 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2018, pp. 2288-2294, doi: 10.1109/ECTC.2018.00344.
Cite this article
Zhong,Y.;Wang,C.;Jiang,Z.;Xu,K.;Wang,Y. (2025). Mitigating Electromagnetic Interference on PCB in Electric Vehicles: A Review. Applied and Computational Engineering,168,63-77.
Data availability
The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.
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References
[1]. IEA (2024), Global EV Outlook 2024, IEA, Paris https://www.iea.org/reports/global-ev-outlook-2024, Licence: CC BY 4.0
[2]. T. Jarin, P. V. Nisha, B. Deepanraj and H. Mewada, ‘Comparison of PCB and Conventional Power Transfer Coils in Magnetic Coupler Designs for Electric Vehicles,’ 2024 International Conference on Smart Systems for applications in Electrical Sciences (ICSSES), Tumakuru, India, 2024, pp. 1-6.
[3]. J. Yao, S. Wang and Z. Luo, ‘Radiated EMI Reduction by Layout Improvement in Power Converters in Automotive Applications,’ 2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), Nanjing, China, 2020, pp. 1894-1899.
[4]. D. Hamza, M. Pahlevaninezhad and P. K. Jain, "Implementation of a Novel Digital Active EMI Technique in a DSP-Based DC–DC Digital Controller Used in Electric Vehicle (EV)," in IEEE Transactions on Power Electronics, vol. 28, no. 7, pp. 3126-3137, July 2013, doi: 10.1109/TPEL.2012.2223764.
[5]. Songchun Zhang. Anti-interference technology for electronic control system and its application [M]. Beijing: China Machine Press 1998
[6]. Kuixuan Han. Introduction to Microwave Unified Measurement and Control System [M]. Beijing: National Defense Industry Press 1965
[7]. BoXue Tan. Principle and Application of Integrated Circuit [M]. Beijing: Publishing House of Electronics Industry 2003
[8]. P. Hemeng, H. Jianyao, J. Chunxu, L. Qunxing, X. Huawei and H. Zhiyuan, "Analysis for the EMI measurement and propagation path in Hybrid Electric Vehicle," 2016 IEEE Information Technology, Networking, Electronic and Automation Control Conference, Chongqing, China, 2016, pp. 1087-1090.
[9]. Zhai, L. (2021). EMI Prediction and Suppression of DC-DC Converter. In: Electromagnetic Compatibility of Electric Vehicle. Key Technologies on New Energy Vehicles. Springer, Singapore. https://doi.org/10.1007/978-981-33-6165-2_4
[10]. H. A. Huynh, Y. Han, S. Park, J. Hwang, E. Song and S. Kim, "Design and Analysis of the DC–DC Converter With a Frequency Hopping Technique for EMI Reduction," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 4, pp. 546-553, April 2018
[11]. J. Ji, W. Chen and X. Yang, "Design and precise modeling of a novel Digital Active EMI Filter," 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), Long Beach, CA, USA, 2016, pp. 3115-3120
[12]. Zhai, L. (2021). Electromagnetic Compatibility of Battery Management System. In: Electromagnetic Compatibility of Electric Vehicle. Key Technologies on New Energy Vehicles. Springer, Singapore. https://doi.org/10.1007/978-981-33-6165-2_7
[13]. D. Hamza, M. Pahlevaninezhad and P. K. Jain, ‘Implementation of a Novel Digital Active EMI Technique in a DSP-Based DC–DC Digital Controller Used in Electric Vehicle (EV),’ in IEEE Transactions on Power Electronics, vol. 28, no. 7, pp. 3126-3137, July 2013
[14]. D. Hamza, M. Pahlevaninezhad and P. K. Jain, ‘Implementation of a Novel Digital Active EMI Technique in a DSP-Based DC–DC Digital Controller Used in Electric Vehicle (EV),’ in IEEE Transactions on Power Electronics, vol. 28, no. 7, pp. 3126-3137, July 2013
[15]. Sorgucu, U. Electromagnetic interference (EMI) shielding effectiveness (SE) of pure aluminum: an experimental assessment for 5G (SUB 6GHZ). J Mater Sci: Mater Electron 34, 2325 (2023).
[16]. Novák, M., Rosina, J., Bendová, H. et al. Low-cost and prototype-friendly method for biocompatible encapsulation of implantable electronics with epoxy overmolding, hermetic feedthroughs and P3HT coating. Sci Rep 13, 1644 (2023).
[17]. Yadav, A., Bera, T.K. Ferrite shielding thickness and its effect on electromagnetic parameters in wireless power transfer for electric vehicles (EVs). J. Eng. Appl. Sci. 70, 132 (2023).
[18]. Shen, X., Kim, JK. Graphene and MXene-based porous structures for multifunctional electromagnetic interference shielding. Nano Res. 16, 1387–1413 (2023).
[19]. Yang, J., Wang, H., Zhang, Y. et al. Layered Structural PBAT Composite Foams for Efficient Electromagnetic Interference Shielding. Nano-Micro Lett. 16, 31 (2024).
[20]. Lee, J.S., Kim, JW., Lee, J.H. et al. Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding. Nano-Micro Lett. 15, 191 (2023).
[21]. Y. Zhang, J. Guo, H. Liu, X. Zhang, Y. Wang and Y. Fan, ‘EMI Measurement and Reduction for SiC MOSFET based Motor Drivers of Electric Vehicles,’ 2023 3rd International Conference on Electrical Engineering and Mechatronics Technology (ICEEMT), Nanjing, China, 2023, pp. 282-286
[22]. A. K. Ghose, S. K. Mandal and G. K. Deb, "PCB design with low EMI," 1995 International Conference on Electromagnetic Interference and Compatibility (INCEMIC), Madras, India, 1995, pp. 69-76, doi: 10.1109/ICEMIC.1995.501563.
[23]. C. R. Paul, Introduction to Electromagnetic Compatibility, John Wiley and Sons, 1992.
[24]. Chao Yang; Kun Yue; Thinking and analysis of PCB design process [J]. Technology and Innovation, 2023, (09): 153-155. DOI:10.15913/j.cnki.kjycx.2023.09.043
[25]. J. -M. Redouté and A. Richelli, ‘A methodological approach to EMI resistant analog integrated circuit design,’ in IEEE Electromagnetic Compatibility Magazine, vol. 4, no. 2, pp. 92-100, 2nd Quarter 2015, doi: 10.1109/MEMC.2015.7204058.
[26]. Han Yang, and Tao Chen.’ Automotive-grade PCB electromagnetic compatibility design.’ Internal combustion engine and accessories .13(2018):11-14.doi:10.19475/j.cnki.issn1674-957x.2018.13.005.
[27]. Z. He and H. Guo, ‘EMR Field Distribution Analysis of Crystal Oscillator on PCB,’2018 12th International Symposium on Antennas, Propagation and EM Theory (ISAPE), Hangzhou, China, 2018, pp. 1-4, doi: 10.1109/ISAPE.2018.8634183.
[28]. M. Ali, J. Friebe and A. Mertens, "3-D Electromagnetic Modeling and Analysis of Electromagnetic Field Couplings of EMI Filter Capacitors," 2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia), Singapore, Singapore, 2021, pp. 1299-1305, doi: 10.1109/ECCE-Asia49820.2021.9479282.
[29]. P. Kadlec, V. Šeděnka, M. Marek and M. Štumpf, "Optimizing a Decoupling Capacitor on a PCB: A Fully Time-Domain Approach Based on PSO and TD-CIM," 2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands, 2018, pp. 585-589, doi: 10.1109/EMCEurope.2018.8485008.
[30]. Shinichi Ikami and Akihisa Sakurai, ‘Practical analysis on 20H rule for PCB,’2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, Singapore, 2008, pp. 180-183, doi: 10.1109/APEMC.2008.4559841.
[31]. F. Gisin and Z. Pantic-Tanner, ‘Radiation from printed circuit board edge structures,’2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161), Montreal, QC, Canada, 2001, pp. 881-883 vol.2, doi: 10.1109/ISEMC.2001.950495.
[32]. Meishuang Chen, Sai Zhu, Lihua Cai, etal. Design for Integrated Circuit EMC Test PCB[J]. SAFETY&EMC, 2021(5):83-87
[33]. C. -H. Lee, C. -Y. Yao, H. -C. Li, D. -B. Lin and H. -P. Lin, "The study of PCB ground area and location on EMI reduction effectiveness," 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL), Singapore, 2017, pp. 1568-1571, doi: 10.1109/PIERS-FALL.2017.8293382.
[34]. S. Haga, K. Nakano and O. Hashimoto, ‘Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge,’2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, USA, 2002, pp. 262-267 vol.1, doi: 10.1109/ISEMC.2002.1032486.
[35]. Z. Ma, S. Wang, Q. Huang and Y. Yang, ‘A Review of Radiated EMI Research in Power Electronics Systems,’ in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 12, no. 1, pp. 675-694, Feb. 2024, doi: 10.1109/JESTPE.2023.3335972.
[36]. J. Yao, S. Wang, and Z. Luo, ‘Modeling, analysis, and reduction of radiated EMI due to the voltage across input and output cables in an automotive non-isolated power converter,’ IEEE Trans. Power Electron., vol. 37, no. 5, pp. 5455–5465, May 2022.
[37]. Ke Wu. Design optimization analysis of digital-analog hybrid PCB electromagnetic compatibility [J]. Integrated circuit applications, 2024, 41 (04): 39-41. DOI:10.19339/j.issn.1674-2583.2024.04.014.
[38]. W. Jiang, k. Cai, B. Sen and G. Wang, ‘Practical High Speed PCB Stack up Tool - Generation and Validation,’ 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2018, pp. 2288-2294, doi: 10.1109/ECTC.2018.00344.