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Published on 13 September 2024
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Wang,S.;Zheng,H.;Wen,X.;Xu,K.;Tan,H. (2024). Enhancing chip design verification through AI-powered bug detection in RTL code. Applied and Computational Engineering,92,27-33.
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Enhancing chip design verification through AI-powered bug detection in RTL code

Shikai Wang *,1, Haotian Zheng 2, Xin Wen 3, Kangming Xu 4, Hao Tan 5
  • 1 Electrical and Computer Engineering, New York University, NY, USA
  • 2 Electrical & Computer Engineering, New York University, NY, USA
  • 3 Applied Data Science,University of Southern California,CA,USA
  • 4 Computer Science and Engineering , Santa Clara University, CA, USA
  • 5 Computer Science and Technology, China University of Geosciences, Beijing, China

* Author to whom correspondence should be addressed.

https://doi.org/10.54254/2755-2721/92/20241685

Abstract

This paper presents a novel AI-driven approach for enhancing chip design verification through automated bug detection in Register Transfer Level (RTL) code. The proposed method integrates advanced machine learning techniques with domain-specific knowledge of chip design to address the challenges of increasing complexity and time-to-market pressures in modern integrated circuit development. Our system employs a comprehensive data preprocessing pipeline that effectively captures syntactic and semantic features of RTL code, feeding into an innovative attention-based neural network model. The model demonstrates superior bug detection accuracy across diverse design categories and bug types compared to traditional methods and existing AI-assisted approaches. Extensive experimental evaluation on a large-scale dataset of RTL designs, including both open-source projects and industry collaborations, validates the effectiveness of our method. The proposed approach achieves a 95% accuracy in bug detection, with a 28-35% reduction in verification time when applied to real-world chip design projects. The paper addresses the interpretability of AI decisions in the context of chip design, presenting novel visualization techniques that enhance trust and facilitate adoption among RTL designers. While acknowledging current limitations, we discuss future research directions, including integration with formal verification methods and extension to system-level verification scenarios. This work contributes significantly to AI-assisted chip design, paving the way for more efficient and reliable development of complex integrated circuits.

Keywords

RTL verification, machine learning, bug detection, chip design automation

[1]. Sankaranarayanan, R., Srinivasan, A., Zaliznyak, A., & Mittai, S. (2021). Chip package co-design and physical verification for heterogeneous integration. In 2021 22nd International Symposium on Quality Electronic Design (ISQED) (pp. 275–280). IEEE.

[2]. Iša, R., Benáček, P., & Puš, V. (2018). Verification of generated RTL from P4 source code. In 2018 IEEE 26th International Conference on Network Protocols (ICNP) (pp. 444-450). IEEE.

[3]. Khoo, K. Y. (2006). Formal verifications in modern chip designs. In 2006 IEEE International High-Level Design and Test Workshop (pp. 38–42). IEEE.

[4]. Sankaranarayanan, R., Srinivasan, A., Zaliznyak, A., & Mittai, S. (2021). Chip package co-design and physical verification for heterogeneous integration. In 2021 22nd International Symposium on Quality Electronic Design (ISQED) (pp. 275–280). IEEE.

[5]. R. Iša, P. Benáček, & V. Puš. (2018). Verification of generated RTL from P4 source code. In 2018 IEEE 26th International Conference on Network Protocols (ICNP) (pp. 444-450). IEEE.

[6]. Li, H., Wang, S. X., Shang, F., Niu, K., & Song, R. (2024). Applications of Large Language Models in Cloud Computing: An Empirical Study Using Real-world Data. International Journal of Innovative Research in Computer Science & Technology, 12(4), 59-69.

[7]. Ping, G., Wang, S. X., Zhao, F., Wang, Z., & Zhang, X. (2024). Blockchain-Based Reverse Logistics Data Tracking: An Innovative Approach to Enhance E-Waste Recycling Efficiency.

[8]. Zhan, X., Shi, C., Li, L., Xu, K., & Zheng, H. (2024). Aspect category sentiment analysis based on multiple attention mechanisms and pre-trained models. Applied and Computational Engineering, pp. 71, 21–26.

[9]. Liu, B., Zhao, X., Hu, H., Lin, Q., & Huang, J. (2023). Detection of Esophageal Cancer Lesions Based on CBAM Faster R-CNN. Journal of Theory and Practice of Engineering Science, 3(12), 36–42.

[10]. Liu, B., Yu, L., Che, C., Lin, Q., Hu, H., & Zhao, X. (2024). Integration and performance analysis of artificial intelligence and computer vision based on deep learning algorithms. Applied and Computational Engineering, pp. 64, 36–41.

[11]. Liu, B. (2023). Based on intelligent advertising recommendations and abnormal advertising monitoring systems in machine learning. International Journal of Computer Science and Information Technology, 1(1), 17–23.

Cite this article

Wang,S.;Zheng,H.;Wen,X.;Xu,K.;Tan,H. (2024). Enhancing chip design verification through AI-powered bug detection in RTL code. Applied and Computational Engineering,92,27-33.

Data availability

The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

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About volume

Volume title: Proceedings of the 6th International Conference on Computing and Data Science

Conference website: https://2024.confcds.org/
ISBN:978-1-83558-595-5(Print) / 978-1-83558-596-2(Online)
Conference date: 12 September 2024
Editor:Alan Wang, Roman Bauer
Series: Applied and Computational Engineering
Volume number: Vol.92
ISSN:2755-2721(Print) / 2755-273X(Online)

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