A Review of the Application and Development of Ultra-thin Silicon Chips

Tianyi Cai

doi:10.54254/2755-2721/2025.20344

Research Article

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Published on 10 January 2025

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Cai,T. (2025). A Review of the Application and Development of Ultra-thin Silicon Chips. Applied and Computational Engineering,125,81-87.

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A Review of the Application and Development of Ultra-thin Silicon Chips

Tianyi Cai *^,1,

¹ Department of Mechanical Engineering, University of Arizona, Tucson, AZ, USA

* Author to whom correspondence should be addressed.

https://doi.org/10.54254/2755-2721/2025.20344

Abstract

The widespread applications of ultra-thin silicon chips across industries such as healthcare, telecommunications, automotive, artificial intelligence, and energy management underscore their pivotal role in driving technological advancements and societal progress by enhancing efficiency, sustainability, and overall performance in various electronic systems. This paper provides an in-depth review of the application and development of ultra-thin silicon chips in modern electronic technology. Ultra-thin silicon chips, characterized by small size, low power consumption, and efficient heat dissipation, offer significant advantages over traditional chips in various electronic products such as smartphones, tablets, and smart wearable devices. The paper discusses the basic principles, fabrication methods, and advantages of ultra-thin silicon chips, highlighting their potential applications in emerging fields like artificial intelligence and the Internet of Things. Furthermore, the paper explores the evolving trends in ultra-thin silicon chip manufacturing technology, emphasizing advancements in nano-technology applications and intelligent manufacturing practices. The diverse applications of ultra-thin silicon chips across industries such as healthcare, telecommunications, automotive, artificial intelligence, and energy management underscore their pivotal role in driving technological advancements and societal progress

Keywords

Ultra-thin silicon chips, Electronic technology, Intelligent manufacturing, Applications in healthcare, Smart devices

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Cite this article

Cai,T. (2025). A Review of the Application and Development of Ultra-thin Silicon Chips. Applied and Computational Engineering,125,81-87.

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The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

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About volume

Volume title: Proceedings of the 3rd International Conference on Mechatronics and Smart Systems

Conference website: https://2025.confmss.org/

ISBN：978-1-83558-909-0(Print) / 978-1-83558-910-6(Online)

Conference date: 16 June 2025

Editor：Mian Umer Shafiq

Series: Applied and Computational Engineering

Volume number: Vol.125

ISSN：2755-2721(Print) / 2755-273X(Online)

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