Analysis on the application and development of microelectronic technology

Research Article
Open access

Analysis on the application and development of microelectronic technology

Wenbo Fan 1*
  • 1 School of Electronic Science and Engineering (National Exemplary School of Microelectronics), University of Electronic Science and Technology of China, Chengdu, Sichuan, China, 611731    
  • *corresponding author f1063824651@163.com
Published on 14 June 2023 | https://doi.org/10.54254/2755-2721/6/20230768
ACE Vol.6
ISSN (Print): 2755-273X
ISSN (Online): 2755-2721
ISBN (Print): 978-1-915371-59-1
ISBN (Online): 978-1-915371-60-7

Abstract

The advancement of science and technology, as well as the passage of time, have resulted in an increase in the use of high-tech products in our daily lives, with microelectronics playing an important role as a fundamental technology. Today, the microelectronics industry is the world's sunrise industry. China is rapidly expanding its microelectronics industry. Microelectronics technology is one of the world's fastest growing technologies, and it is the foundation of the information industry in the information age. Now, microelectronics technology has become a standard for measuring a country's level of science and technology. This paper, using a method of literature review, focuses on discussing and summarizing the development and application of microelectronics technology in China, as well as providing some possible correct solutions.

Keywords:

Microelectronic Technology, Current situation, Application, Development.

Fan,W. (2023). Analysis on the application and development of microelectronic technology. Applied and Computational Engineering,6,128-132.
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References

[1]. Jia Chuanxuan . Opportunities and challenges of China's integrated circuit industry [ J ] . Integrated Circuit Applications, 2017(2): 84-86

[2]. FENG Xiaojia. Discussion on the current situation of microelectronics technology development in China[J]. Information and Documentary Materials, 2019, 20(6): 79-80.

[3]. WU Ximing. The current situation and development trend of microelectronics technology[J]. Digital Users, 2014(24): 376-376. DOI:10.3969/j.issn.1009-0843.2014.24.337.

[4]. Lu Mengjin. The current situation and development trend of microelectronics technology. Knowledge - Power, September 32, 2019

[5]. FANG Zhiming. Some of the latest developments in microelectronics science and technology in material physics[J]. Journal of Huangshan University,2004,6(3):34-38.] DOI:10.3969/j.issn.1672-447X.2004.03.016.

[6]. XI Yanmei. Thermal Characteristics and Thermal Stress Based on Ball Grid Array Leaded Bonded Package Structure[D]. Beijing:Beijing University of Technology,2008.

[7]. LU Yudong,HE Xiaoqi,EN Yunfei. Implementation and Reliability of Lead Bonding Technology in 3D Package[J]. Microelectronics,2009,39(5):710-713.

[8]. YANG Yafei. Research on Key Technologies and Application Prospects of Microelectronic Packaging[J]. Information and Computer, 2016(1):41, 43. DOI:10.3969/j.issn.1003-9767.2016.01.025.

[9]. CHEN Jiawei. On the limitations and development prospects of microelectronics technology[J]. Modern Information Technology,2018,2(5):42-43. DOI:10.3969/j.issn.2096-4706.2018.05.018

[10]. XIE Yijia. Application and Development of Microelectronics[J]. Science and Informatization, 2018(32):52,57.

[11]. SHAO Yunfei,LYU Wei. China's Internet of Things industry collaborative innovation led by telecom operators Integration Research[J].Chinese Journal of Management,2016,13(02):239-247.

[12]. Fang Zhenhua,Huang Huifeng. Application Status of Microelectro-Mechanical System (MEMS) Technology in Military Equipment[J]. Electromechanical Engineering, 2010, 26(4): 1-4, 13. DOI:10.3969/j.issn.1008-5300.2010.04.001.

[13]. XU Jun. Research on modular structure and business model innovation of Internet of Things industry[D].Nanjing:Nanjing University of Finance and Economics,2014.

[14]. WANG Liyong. Application of Microelectronics Technology in Biomedicine[J]. Research on Urban Construction Theory (Electronic Edition), 2014(18):1229-1229.

Cite this article

Fan,W. (2023). Analysis on the application and development of microelectronic technology. Applied and Computational Engineering,6,128-132.

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About volume

Volume title: Proceedings of the 3rd International Conference on Signal Processing and Machine Learning

ISBN：978-1-915371-59-1(Print) / 978-1-915371-60-7(Online)
Editor：Omer Burak Istanbullu
Conference website: http://www.confspml.org
Conference date: 25 February 2023
Series: Applied and Computational Engineering
Volume number: Vol.6
ISSN：2755-2721(Print) / 2755-273X(Online)

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References

[1]. Jia Chuanxuan . Opportunities and challenges of China's integrated circuit industry [ J ] . Integrated Circuit Applications, 2017(2): 84-86

[2]. FENG Xiaojia. Discussion on the current situation of microelectronics technology development in China[J]. Information and Documentary Materials, 2019, 20(6): 79-80.

[3]. WU Ximing. The current situation and development trend of microelectronics technology[J]. Digital Users, 2014(24): 376-376. DOI:10.3969/j.issn.1009-0843.2014.24.337.

[4]. Lu Mengjin. The current situation and development trend of microelectronics technology. Knowledge - Power, September 32, 2019

[5]. FANG Zhiming. Some of the latest developments in microelectronics science and technology in material physics[J]. Journal of Huangshan University,2004,6(3):34-38.] DOI:10.3969/j.issn.1672-447X.2004.03.016.

[6]. XI Yanmei. Thermal Characteristics and Thermal Stress Based on Ball Grid Array Leaded Bonded Package Structure[D]. Beijing:Beijing University of Technology,2008.

[7]. LU Yudong,HE Xiaoqi,EN Yunfei. Implementation and Reliability of Lead Bonding Technology in 3D Package[J]. Microelectronics,2009,39(5):710-713.

[8]. YANG Yafei. Research on Key Technologies and Application Prospects of Microelectronic Packaging[J]. Information and Computer, 2016(1):41, 43. DOI:10.3969/j.issn.1003-9767.2016.01.025.

[9]. CHEN Jiawei. On the limitations and development prospects of microelectronics technology[J]. Modern Information Technology,2018,2(5):42-43. DOI:10.3969/j.issn.2096-4706.2018.05.018

[10]. XIE Yijia. Application and Development of Microelectronics[J]. Science and Informatization, 2018(32):52,57.

[11]. SHAO Yunfei,LYU Wei. China's Internet of Things industry collaborative innovation led by telecom operators Integration Research[J].Chinese Journal of Management,2016,13(02):239-247.

[12]. Fang Zhenhua,Huang Huifeng. Application Status of Microelectro-Mechanical System (MEMS) Technology in Military Equipment[J]. Electromechanical Engineering, 2010, 26(4): 1-4, 13. DOI:10.3969/j.issn.1008-5300.2010.04.001.

[13]. XU Jun. Research on modular structure and business model innovation of Internet of Things industry[D].Nanjing:Nanjing University of Finance and Economics,2014.

[14]. WANG Liyong. Application of Microelectronics Technology in Biomedicine[J]. Research on Urban Construction Theory (Electronic Edition), 2014(18):1229-1229.

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