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A review of physical heat dissipation methods for 3D integrated technology
- 1 Zhongkai University of Agriculture and Engineering
* Author to whom correspondence should be addressed.
Abstract
Three-dimensional integrated circuits have higher integration than two-dimensional integrated circuits, and can obtain higher performance and lower power consumption in a certain space. In order to fulfill higher efficiency, thermal management becomes particularly important in 3D integration technology. However, the traditional heat dissipation method cannot satisfy the heat dissipation needs of three-dimensional integrated circuits, which require better heat dissipation methods to be developed. This paper introduces the realization of three-dimensional integrated circuit using silicon via (TSV) technology, which allows the chip to be vertically stacked to transmit information. This paper summarizes the research methods and findings of three-dimensional integrated circuit heat dissipation in recent years, including thermal through silicon via (TTSV) and microchannel cooling. It also emphasizes the advantages and disadvantages of both mehods, and the challenges faced in current research via an overview. The future research trend for both heat dissipation methods mainly consists of combining special algorithms to achieve thermal-electrical codesign and thermal management of three-dimensional integrated circuits.
Keywords
three-dimensional integrated circuit, through silicon via, thermal through silicon via, microfluidics cooling
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Cite this article
Li,C. (2024). A review of physical heat dissipation methods for 3D integrated technology. Applied and Computational Engineering,89,55-59.
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