
Research on Simulation Methodology for Gallium Oxide-Based MOSFETs: Electrothermal Characteristics and Reliability Degradation Mechanism
- 1 Tianjin University, No. 92, Weijin Road, Nankai District, Tianjin, China
* Author to whom correspondence should be addressed.
Abstract
Beta-phase gallium oxide (β-Ga2O₃), as an ultra-wide bandgap semiconductor (4.5–4.9 eV), demonstrates superior critical breakdown field strength (8 MV/cm) compared to SiC and GaN material systems, showing significant potential for next-generation high-power electronics. Nevertheless, inherent limitations including the absence of stable p-type doping leading to depletion-mode operation and low thermal conductivity (~27 W/m·K) causing severe self-heating effects hinder practical applications. This study establishes a multi-physics coupled simulation platform using Sentaurus TCAD to systematically investigate the steady-state electrical characteristics and thermal reliability of β-Ga2O₃ MOSFETs. A self-consistent electrothermal model reveals a threshold voltage of -3.5 V and breakdown voltage of 100 V at 300 K. Thermal stability analysis demonstrates that elevated temperature (600 K) increases leakage current by two orders of magnitude due to thermally excited carrier accumulation, accompanied by a 0.8 V negative shift in threshold voltage. Defect density gradient simulations further uncover that bulk trap concentrations exceeding 1×10¹⁷ cm-3 under off-state conditions induce significant recombination in space charge regions, triggering anomalous conduction phenomena. This work provides theoretical guidance for overcoming thermal management challenges and enhancing reliability in Ga2O3-based devices.
Keywords
β-Ga2O₃, Electrothermal coupling, reliability, trap
[1]. Gao Jiacheng. Research on Novel Gallium Oxide Power Devices [D]. University of Electronic Science and Technology of China, 2023.
[2]. Higashiwaki M, Sasaki K, Kuramata A, et al. Gallium oxide (Ga2O3) metal-semiconductor fieldeffect transistors on single-crystal β-Ga2O3 (010) substrates[J]. Applied Physics Letters, 2012,
[3]. Higashiwaki M, Sasaki K, Kamimura T, et al. Depletion-mode Ga2O3 metal-oxidesemiconductor field-effect transistors on β-Ga2O3 (010) substrates and temperature dependence of their device characteristics[J]. Applied Physics Letters, 2013, 103(12): 123511
[4]. Wong M H, Sasaki K, Kuramata A, et al. Field-plated Ga2O3 MOSFETs with a breakdown
[5]. Chabak K D, McCandless J P, Moser N A, et al. Recessed-Gate Enhancement-Mode β-Ga2O3 MOSFETs[J]. IEEE Electron device letters, 2017, 39(1): 67-70.
[6]. Zeng K, Vaidya A, Singisetti U. 1.85 kV breakdown voltage in lateral field-plated Ga2O3 MOSFETs[J]. IEEE Electron Device Letters, 2018, 39(9): 1385-1388.
[7]. Sharma S, Zeng K, Saha S, et al. Field-plated lateral Ga2O3 MOSFETs with polymer passivation and 8.03 kV breakdown voltage[J]. IEEE Electron Device Letters, 2020, 41(6): 836-839.
[8]. Wang Y, Gong H, Jia X, et al. Demonstration of β-Ga2O3 Superjunction-Equivalent MOSFETs[J]. IEEE Transactions on Electron Devices, 2022, 69(4): 2203-2209.
[9]. Peng Xiaosong. Structural Design and Characteristic Research of Gallium Oxide Power Field-Effect Transistors [D]. University of Electronic Science and Technology of China, 2024.
[10]. Qiao Rundi. Research on Vertical Gallium Oxide MOSFET Model and Device Design [D]. Xidian University, 2021
[11]. Wang Guanfei. Research on Enhancement/Depletion Mode β-Ga₂O₃ Field-Effect Transistors [D]. Xidian University, 2021.
[12]. Liu Dinghe. Solutions to Thermal Issues in Ultra-Wide Bandgap Gallium Oxide Devices [J]. Electronics and Packaging, 2024, 24(11):90.
[13]. Wang Lei. Research on Breakdown Characteristics of Gallium Oxide Lateral Field-Effect Transistors [D]. Nanjing University of Posts and Telecommunications, 2023.
[14]. Jiang Zhuolin. Research on Mechanism and Reliability of Novel High-Voltage Low-Power Gallium Oxide MOSFETs [D]. University of Electronic Science and Technology of China, 2024.
Cite this article
Zhou,J. (2025). Research on Simulation Methodology for Gallium Oxide-Based MOSFETs: Electrothermal Characteristics and Reliability Degradation Mechanism. Applied and Computational Engineering,141,60-69.
Data availability
The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.
Disclaimer/Publisher's Note
The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of EWA Publishing and/or the editor(s). EWA Publishing and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.
About volume
Volume title: Proceedings of the 3rd International Conference on Mechatronics and Smart Systems
© 2024 by the author(s). Licensee EWA Publishing, Oxford, UK. This article is an open access article distributed under the terms and
conditions of the Creative Commons Attribution (CC BY) license. Authors who
publish this series agree to the following terms:
1. Authors retain copyright and grant the series right of first publication with the work simultaneously licensed under a Creative Commons
Attribution License that allows others to share the work with an acknowledgment of the work's authorship and initial publication in this
series.
2. Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the series's published
version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgment of its initial
publication in this series.
3. Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and
during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See
Open access policy for details).