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Luo,Y. (2023). Review of innovations in low-power flip-flops based on the development of innovative logic gates. Applied and Computational Engineering,23,52-58.
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Review of innovations in low-power flip-flops based on the development of innovative logic gates

Youbin Luo *,1,
  • 1 Nanjing University

* Author to whom correspondence should be addressed.

https://doi.org/10.54254/2755-2721/23/20230611

Abstract

Integrated circuits have advanced quickly alongside the semiconductor industry's tremendous growth. The primary design considerations for each circuit in a VLSI data path are minimization of area and power consumption. As a very important logic unit in the integrated circuit, reducing the flip-flop's power consumption is of great significance for improving the performance of the whole circuit. There are many ways to reduce the power consumption of the flip-flop. This paper reviews several new low-power flip-flop designs using methods to improve the logic structure of flip-flops and their logic gates, including a reversible flip-flop design with reversible gates, a flip-flop design with memristors, and a sense amplifier-based flip-flop. The analysis shows that all three options for improving the logic gate can reduce the power consumption of the flip-flops and also have a positive effect on reducing the size of the device.

Keywords

flip-flop, reversible logic, low power design, memristor

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Cite this article

Luo,Y. (2023). Review of innovations in low-power flip-flops based on the development of innovative logic gates. Applied and Computational Engineering,23,52-58.

Data availability

The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

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About volume

Volume title: Proceedings of the 2023 International Conference on Functional Materials and Civil Engineering

Conference website: https://www.conffmce.org/
ISBN:978-1-83558-067-7(Print) / 978-1-83558-068-4(Online)
Conference date: 26 August 2023
Editor:Bhupesh Kumar
Series: Applied and Computational Engineering
Volume number: Vol.23
ISSN:2755-2721(Print) / 2755-273X(Online)

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