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Systematic analysis of microelectronic chip packaging materials
- 1 Sun Yat-sen University
* Author to whom correspondence should be addressed.
Abstract
Microelectronics is a recent hot field, and packaging is an indispensable part of making microelectronic chips. This article introduces the commonly used materials in the field of microelectronic chip packaging. It first presents two complex polymer raw materials recently becoming hot topics, namely epoxy resin and silicone. Then the article presents these two materials from the perspectives of their characteristics, advantages in packaging, and further research directions, allowing readers to have a basic understanding of them while also gaining a general understanding of their research progress. Afterward, the article introduces three crucial types of functional materials in packaging. The article not only presents their respective uses, but also classifies them from the main material types. The article not only analyzes the characteristics and application fields of each material, but also provides some existing in-depth research directions for reference. This article helps readers quickly understand the relevant knowledge of some microelectronic chip packaging materials, especially in determining their future research direction.
Keywords
Electronic Packaging, Epoxy Resin, Organic Silicon, Conductive Adhesive, Electromagnetic Shielding
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Cite this article
Shi,Y. (2024). Systematic analysis of microelectronic chip packaging materials. Applied and Computational Engineering,58,48-53.
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Volume title: Proceedings of the 4th International Conference on Materials Chemistry and Environmental Engineering
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