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Published on 10 January 2025
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Yu,J. (2025). Influence of SiC MOSFET Drive Control Parameters on Short Circuit Characteristics. Applied and Computational Engineering,125,40-46.
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Influence of SiC MOSFET Drive Control Parameters on Short Circuit Characteristics

Jiajia Yu *,1,
  • 1 University of Electronic Science and Technology of China

* Author to whom correspondence should be addressed.

https://doi.org/10.54254/2755-2721/2025.20008

Abstract

This paper focuses on the short-circuit characteristics of SiC MOSFETs. The SiC MOSFET, categorized as a third-generation wide bandgap power semiconductor, shows significant promise for use in high-voltage applications. Short-circuit faults are categorized into hard-switch short circuits and load short circuits. The drive parameters, including Gate Resistance, Gate-Source Voltage, and DC Bus Voltage, significantly affect the short-circuit characteristics. Increasing Gate Resistance can slow down the rise rate and peak value of short-circuit current, reducing the risk of device damage, although too much Gate Resistance will slow down the switching speed. Raising the Gate-Source Voltage increases the short-circuit current peak and accelerates the rise time, but too high a Gate-Source Voltage increases the risk of device damage. The DC Bus Voltage does not have a significant effect on the short-circuit current but primarily influences the Gate-Source Voltage. Studying the influence of drive parameters on short-circuit characteristics is crucial for optimizing design and improving system stability

Keywords

Drive control parameter, Short-circuit characteristics, Silicon carbide, Short circuit protection

[1]. Yang F, Wang L, Kong H, et al.​ Compact-​Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-​SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature[J].​ IEEE Transactions on Power Electronics, 2022, 38(1):​417-​434.​

[2]. Baliga B J.​ Fundamentals of power semiconductor devices[M].​ New York:​ Springer Science &​ Business Media, 2010.​ 50-​317

[3]. Shenai K, Scott R S, Baliga B J.​ Optimum semiconductors for high-​power electronics[J].​ IEEE Transactions on Electron Devices, 1989, 36(9):​1811-​1823

[4]. Baliga B J.​Power applications[J].​IEEE semiconductor Electron Device device figure of merit for high—fi'equency Letters, 1989, 10(10):​455—457.​

[5]. zpineci vehicle B.​System impact of silicon applications[M].​Doctoral carbide power electronics Dissertations.​2002.​

[6]. Sheng H, Chen Z, Wang F, et al.​ Investigation of 1.​2 kV SiC MOSFET for high frequency high power applications[C].​ Applied Power Electronics Conferenceand Exposition, California, United States, 2010:​ 1572-​1577.​

[7]. Hudgins J L, Simin G S, Santi E, et al.​ An assessment of wide bandgap semiconductors for power devices[J].​ IEEE Transactions on Power Electronics, 2003, 18(3):​ 907-​914.​

[8]. Glaser J S, Nasadoski J J, Losee P A, et al.​ Direct comparison of silicon and silicon carbide power transistors in high-​frequency hard-​switched applications[C].​ Applied Power Electronics Conference and Exposition, Texas, United States, 2011:​ 1049-​1056.​

[9]. Cai Y, Xu H, Sun P, et al.​ Effect of threshold voltage hysteresis on switching characteristics of silicon carbide MOSFETs[J].​ IEEE Transactions on Electron Devices, 2021, 68(10):​5014 5021.​

[10]. Wen Y, Yang Y, Gao Y.​ Active gate driver for improving current sharing performance of 81 paralleled high-​power SiC MOSFET modules[J].​ IEEE Transactions on power electronics, 2020, 36(2):​1491-​1505.​

[11]. Zhang L, Yuan X, Wu X, et al.​ Performance evaluation of high-​power SiC MOSFET modules in comparison to Si IGBT modules[J].​ IEEE Transactions on Power Electronics, 2018, 34(2):​ 1181-​1196.​

[12]. Fuentes C D, Kouro S, Bernet S.​ Comparison of 1700-​V SiC-​MOSFET and Si-​IGBT modules under identical test setup conditions[J].​ IEEE Transactions on Industry Applications, 2019, 55(6):​7765-​7775.​

[13]. XuShe, AlexQ.​Huang, Oscar Lucia et a1.​”Review ofSilicon CarbidePowerDevices and TheirApplications”IEEE Trans.​Industrial Eleclronics, v01.​64, no.​10, PP.​8193—8205, Oct.​ 2017

[14]. Lee S, Kim K, Shim M, et al.​ A digital signal processing based detection circuit for short circuit protection of SiC MOSFET[J].​ IEEE Transactions on Power Electronics, 2021, 36(12):​13379-​13382.​

[15]. Ji S, Laitinen M, Huang X, et al.​ Short-​circuit characterization and protection of 10-​kV SiC MOSFET[J].​ IEEE Transactions on Power Electronics, 2018, 34(2):​1755-​1764.​

[16]. Z.​ Wang et al.​ Temperature-​Dependent Short-​Circuit Capability of Silicon Carbide Power MOSFETs[J].​ IEEE Transactions on Power Electronics, 2016, 31(2), 1555-​1556.​

[17]. Boige F, Richardeau F.​ Gate leakage-​current analysis and modelling of planar and trench powerSiC MOSFET devices in extreme short-​circuit operation[J].​ Microelectronics Reliability, 2017, 76:​ 532-​538.​

[18]. J.​ Wang, Z.​ Shen, C.​ DiMarino, R.​ Burgos and D.​ Borovevich, et al, “Gate driver design for 1.​7kV SiC MOSFET module with Rogowski current sensor for shortcircuit protection, ”2016 IEEE Applied Power Electronics Conference and Exposition(APEC), Long Beach, CA, 2016, pp:​ 516-​523.​

[19]. D.​ Othman, M.​ Berkani, S.​ Lefebvre, A.​ Ibrahim, Z.​ Khatir, and A.​ Bouzourene, et al.​ Comparis on study on performences and robustness between SiC MOSFET&​JFET devices-​Abilities for aeronautics application, European Symposium on the Reliablity of Electron Devices, Failure Physics and Analysis.​ vol.​ 52.​ on.​ 9:​ pp.​ 1859-​1964.​ Sep-​2012.​

[20]. Z.​ Wang, et al.​ “Temperature-​dependent Short-​circuit Capabiliilicon CarbidePower MOSFETs” in IEEE Transactions on Power Electronics:​ vol 31, no.​ 2, pp .​1555-​1566 Feb 2016.​

[21]. X.​ Huang, G.​ Wang Y Li, A.​Q.​ Huang and B Jayant Baliga.​ Short-​circuit capabilityof 1200 V Sic MOSFET and JFET for fault protection, in Proc.​ IEEE Appl.​ PowerElectron.​ Conf Expo.​ 2013, pp.​ 197-​200.​

[22]. X.​ Liao, H.​ Li, Y Hu, Z.​ Huang, E.​ Song and H.​ Xiao, et al.​ Analysis of SiC MOSFET dI/​dt and its temperature dependence[C].​ IECON 2017-​43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, 2017:​ 64-​869.​

[23]. T.​ Nguyen, A.​ Ahmed, T.​ V.​ Thang and J Park, et al, Gate Oxide Reliability Issues of Sic MOSFETS Under Short-​circuit Operation, in IEEE Transactions on Power Electronicsvol.​ 30, no 5, pp.​ 2445-​2455, May 2015.​

[24]. G.​ Romano, et al.​ A Comprehensive Study of Short-​circuit Ruggedness of SiliconCarbide Power MOSFETS, in IEEE Joumal of Emerging and Selected Topics in PowerElectronics, vol 4, no 3, pp.​ 978-​987, Sept 2016.​

[25]. Xing D, Hu B, Kang M, et al.​ 1200-​V SiC MOSFET short-​circuit ruggedness evaluation and methods to improve withstand time[J].​ IEEE Journal of Emerging and Selected Topics in Power Electronics, 2022, 10(5):​5059-​5069.​

[26]. Cui M , Li J , Du Y , et al.​Behavior of SiC MOSFET under Short-​Circuit during the On-​State[C]/​/​State Key Laboratory of Advanced Power Transmission Technology (Global Energy Interconnection Research Institute of State Grid Corporation of China);State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources (North China Electric Power University);, 2018:​10.​

[27]. Zhang M, M.​ Research on SiC MOSFET Short-​circuit and Overload Protection Method and Chip Implementation [D].​ Xi'an University of Technology, 2023.​DOI:​10.​27398/​d.​cnki.​gxalu.​2023.​000626.​

Cite this article

Yu,J. (2025). Influence of SiC MOSFET Drive Control Parameters on Short Circuit Characteristics. Applied and Computational Engineering,125,40-46.

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About volume

Volume title: Proceedings of the 3rd International Conference on Mechatronics and Smart Systems

Conference website: https://2025.confmss.org/
ISBN:978-1-83558-909-0(Print) / 978-1-83558-910-6(Online)
Conference date: 16 June 2025
Editor:Mian Umer Shafiq
Series: Applied and Computational Engineering
Volume number: Vol.125
ISSN:2755-2721(Print) / 2755-273X(Online)

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