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Published on 14 August 2024
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Liu,T. (2024). FPGA-based SPI serial communication. Applied and Computational Engineering,72,157-163.
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FPGA-based SPI serial communication

Taozhe Liu *,1,
  • 1 Xi'an Jiaotong University

* Author to whom correspondence should be addressed.

https://doi.org/10.54254/2755-2721/72/20241021

Abstract

With advances in computer and IoT technology, the realization of the Internet of Everything is just around the corner. Synchronous serial bus communication with simple, high-speed interfaces and easy implementation will become a key player in the electronics industry. However, due to factors such as I/O resources, timing constraints, and register resources, general microcontrollers have various problems. The serial bus communication of I/O simulation has a low transmission rate and cannot achieve true full duplex communication. SPI is a standard for serial transmission introduced by Motorola in the United States. It is a high-speed, full-duplex, synchronous communication bus. Peripheral chips with SPI interface are abundant and widely used. This design uses Verilog HDL language to describe the function, based on the FPGA platform, verifies the SPI serial communication protocol, and realizes the serial communication between the sender and the receiver. SPI has important research significance for enhancing the stability of inter-device communication, improving communication speed and transmission security in the future.

Keywords

Serial port communication, SPI, Verilog HDL

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Cite this article

Liu,T. (2024). FPGA-based SPI serial communication. Applied and Computational Engineering,72,157-163.

Data availability

The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

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About volume

Volume title: Proceedings of the 2nd International Conference on Functional Materials and Civil Engineering

Conference website: https://www.conffmce.org/
ISBN:978-1-83558-489-7(Print) / 978-1-83558-490-3(Online)
Conference date: 23 August 2024
Editor:Ömer Burak İSTANBULLU
Series: Applied and Computational Engineering
Volume number: Vol.72
ISSN:2755-2721(Print) / 2755-273X(Online)

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