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Published on 25 May 2023
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Che,H. (2023). Simulation study on dynamic characteristics of SiC MOSFET. Theoretical and Natural Science,5,803-812.
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Simulation study on dynamic characteristics of SiC MOSFET

Haoming Che *,1,
  • 1 Waseda University

* Author to whom correspondence should be addressed.

https://doi.org/10.54254/2753-8818/5/20230507

Abstract

In this paper, the third generation power MOSFET is introduced, and the physical model based on silicon based MOSFET is improved for SiC MOSFET, and the commercial planar gate and trench gate 1.2kV SiC MOSFET are simulated. The accuracy of physical modals is tested by comparing the static characteristics with commercial ones. The dynamic characteristics of two MOSFETs are simulated by inductively clamped double pulse circuit, and the circuit parameters are analyzed according to the static characteristics of the devices. The switching loss of the two MOSFETs is calculated and compared by using TCAD software. In the two devices with the same volume, the trench gate structure has the larger switching loss.

Keywords

SiC MOSFET, modelling, double pulse test, switching loss

[1]. J.W.Palmour et al.,“Silicon Carbide Power MOSFETs Breakthrough Performance from 900 V up to 15 kV”,International Symposium on Power Semiconductor Devices and IC’s (ISPD), 2014.

[2]. J. L. Hudgins, G. S. Simin, E. Santi, and M. A. Khan, "An assessment of wide bandgap semiconductors for power devices," IEEE Transactions on Power Electronics, vol. 18, no. 3, pp. 907-914, 2003.

[3]. L. D. Stevanovic, K. S. Matocha, P. A. Losee, J. S. Glaser, J. J. Nasadoski, and S. D. Arthur, "Recent advances in silicon carbide MOSFET power devices," in Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE, 2010, pp. 401-407: IEEE.

[4]. J. Millan, P. Godignon, X. Perpi na, A. Perez-Tomas, and J. Rebollo,“A survey of wide bandgap power semiconductor devices,” IEEE Trans.Power Electron.,May 2014, vol. 29, no. 5, pp. 2155–2163.

[5]. M. Östling, R. Ghandi, and C.-M. Zetterling, "SiC power devices—Present status, applications and future perspective," in Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on, 2011, pp. 10-15: IEEE.

[6]. Y. Baba, N. Matuda, S. Yawata, S. Izumi, N. Kawamura and T. Kawakami, "High reliability UMOSFET with oxide-nitride complex gate structure," Proceedings of 9th International Symposium on Power Semiconductor Devices and IC's, 1997, pp. 369-372, doi: 10.1109/ISPSD.1997.601520.

[7]. Ganesan P, Manju R, Razila K R and R. J. Vijayan, "Characterisation of 1200V, 35A SiC Mosfet using double pulse circuit," 2016 IEEE International Conference on Power Electronics, Drives and Energy Systems (PEDES), 2016, pp. 1-6, doi: 10.1109/PEDES.2016.7914225.

[8]. S. R. El-Helw, J. P. Kozak, R. Burgos, K. Ngo and D. Boroyevich, "Static and Dynamic Characterization of a 2.5 kV SiC MOSFET," 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2018, pp. 199-203, doi: 10.1109/WiPDA.2018.8569044.

[9]. K. Matsui, R. Aiba, H. Yano, N. Iwamuro, M. Baba and S. Harada, "Comprehensive Study on Electrical Characteristics in 1.2 kV SiC SBD-integrated Trench and Planar MOSFETs," 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2021, pp. 215-218, doi: 10.23919/ISPSD50666.2021.9452287.

[10]. Yu, Z., and R.W. Dutton, "SEDAN III-A Generalized Electronic Material DeviceAnalysis Program", Stanford Electronics Laboratory Technical Report, Stanford University, July 1985

[11]. Lombardi et al, "A Physically Based Mobility Model for Numerical Simulation of Non-Planar Devices", IEEE Trans. on CAD, pp. 1164, Nov. 1988.

[12]. Kagawa, Yasuhiro & Fujiwara et al. (2014). 4H-SiC trench MOSFET with bottom oxide protection. Materials Science Forum. 778-780. 919-922.

[13]. H. Chen, J. Hao, Q. Zhou, Q. Feng and Y. Bai, "The Characteristics and Modeling of 600V and 1200V SiC Power MOSFET," 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2018, pp. 1-3, doi: 10.1109/ICSICT.2018.8564913.

Cite this article

Che,H. (2023). Simulation study on dynamic characteristics of SiC MOSFET. Theoretical and Natural Science,5,803-812.

Data availability

The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

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About volume

Volume title: Proceedings of the 2nd International Conference on Computing Innovation and Applied Physics (CONF-CIAP 2023)

Conference website: https://www.confciap.org/
ISBN:978-1-915371-53-9(Print) / 978-1-915371-54-6(Online)
Conference date: 25 March 2023
Editor:Marwan Omar, Roman Bauer
Series: Theoretical and Natural Science
Volume number: Vol.5
ISSN:2753-8818(Print) / 2753-8826(Online)

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